COOLER- A Fast Multiobjective Fixed-outline Thermal Floorplanner

In this work, we study multiobjective thermal-aware floorplanning in the fixed-outline context. Our baseline implementation demonstrates a 14% average interconnect improvement over Parquet for ami49, and can additionally optimize peak on-chip temperature. To circumvent the expense of Compact Thermal Models, we develop a novel approach to power-density aware floorplanning, but rigorously evaluate final layouts using a standard methodology based on the Hotspot tool. With these techniques, our multiobjective floorplanner COOLER, reduces peak temperature on MCNC circuits by 15.3°C, which is similar to the 15.1°C reduction achieved by Hotfloorplan. However, our tool is 11-146 times faster than Hotfloorplan. We also show that solutions found by Hotfloorplan lie on the Pareto front generated by COOLER.